About Us
We are a one-stop shop for you to get FPGA, ASIC, Signal Processing, Antenna, and IC Design Services!
FPGA, ASIC, and Signal Processing Designs with First-Pass Success
We are a New York-based RF electronics and engineering company that provides turnkey FPGA, ASIC, MIMO Antenna, and Signal Processing designs and layouts. We have been in the market for over two decades, all thanks to our first-pass success.
- FPGA RTL Designs
- Embedded Engineering Layouts
- Sub-Terahertz Chipsets
- UVM and STA Methodologies
RAD-hardened Aerospace and IEEE Compliant 5G/6G Chip Designs
When it comes to custom designs for radio frequency chipsets, Netiqate leads the way with digital supremacy and ideal code-compliance. With rigorous testing strategies, we ensure every FPGA, ASIC and DSP layout meets the industry standards.
Industrial Telecommunication Expertise
1.6T Ethernet switch layouts and next-gen baseband accelerator designs at Netiqate are the perfect solution to the problems of Tier-1 telecommunication OEMs. Simulation and implementation of 224G SerDes pathways and DSP promises ultra-low latency in our designs.
The Aerospace Specialization
We not only create RAD-hardened layout designs but also ensure they comply with industrial standards. To get flight-ready designs, our experts use DO-254 compliance. Also, to make every chip withstand radiation events, we optimize designs with SEU-mitigation in mind.
Testimonials That Speak For Themselves
reviews
4.8
Take A Look At Our Team
Pedro Simmons
Samantha Byers
Jonathan Reevs
Lucy Byrne
Phone Number
63563563563
info@netiqate.com
address
667 Madison Ave, New York, NY 10065
Frequently Asked Questions
What is your company’s core expertise?
We focus on ASIC and FPGA design that actually makes it to silicon. A lot of our work lives at advanced nodes, including 2nm FinFET, where small mistakes get expensive fast. We take abstract logic and stress it. This helps the team turn it into silicon that can be manufactured and shipped.
What is your experience in the semiconductor industry?
The team has been doing this for more than ten years. We’ve seen the shift from older planar nodes to modern chiplet-based designs. Along the way, we’ve delivered hundreds of GDSII tape-outs across aerospace, telecom, and automotive programs, not demos or test chips.
Where is your engineering team located?
Our engineers work out of dedicated design centers set up for serious silicon work. The labs run current Cadence and Keysight ADS tools, not stripped-down versions. Projects move across time zones using a secure, distributed setup so work doesn’t stop when one office signs off.
What sets your company apart from other design houses?
We design with first-pass success in mind because re-spins hurt schedules and budgets. DTCO is baked in early, not added later as damage control. Verification also starts sooner than most firms expect, with AI-assisted flows used to catch problems before tape-out.
What is your firm’s status on mission-critical hardware designs?
When it comes to mission-critical hardware, Netiqate is one of the few firms that’s certified. We operate under ISO 26262 ASIL-D for automotive programs. The team also integrates DO-254 for aerospace hardware and NIST FIPS for security-sensitive designs. These aren’t box-check exercises. The same quality systems govern every layout, netlist, and bitstream we release.
Do you partner with specific foundries like TSMC or Samsung?
We don’t lock clients into a single foundry. That said, we work closely with TSMC, Samsung Foundry, and Intel Foundry Services. This lets us tune designs directly against real PDKs and focus on yield instead of theory.
How do you handle intellectual property (IP) security?
IP protection is treated as a design constraint at Netiqate. We ensure that every sensitive project is always executed in encrypted and air-gapped environments. That’s how the team ensures that access to your FPGA and ASIC layouts is rigorously controlled. Simultaneously, we regulate the security models as per Common Criteria EAL5 to make the protocols even better.
What is your company's vision for the future of silicon?
Monolithic scaling is slowing. We’re leaning into 3D-IC and heterogeneous integration instead. The long-term direction is UCIe-compliant chiplet systems that can scale without pushing physics past its limits. That’s where silicon is heading, whether the industry likes it or not.